Exclusive

Publication

Byline

Location

US Patent Issued to DENSO, SENJU METAL INDUSTRY on April 21 for "Method for manufacturing soldered products" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,783, issued on April 21, was assigned to DENSO Corp. (Kariya-city, Japan) and SENJU METAL INDUSTRY Co. LTD. (Tokyo). "Method for manufactu... Read More


US Patent Issued on April 21 for "Semiconductor manufacturing equipment" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,784, issued on April 21. "Semiconductor manufacturing equipment" was invented by Cheolan Kwon (Suwon-si, South Korea) and Jingyu Moon (Suw... Read More


US Patent Issued to LINCOLN GLOBAL on April 21 for "Detection of contact tip consumption with welding" (Ohio Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,785, issued on April 21, was assigned to LINCOLN GLOBAL INC. (Santa Fe Springs, Calif.). "Detection of contact tip consumption with weldin... Read More


US Patent Issued to Illinois Tool Works on April 21 for "Systems and methods to configure a robotic welding system" (Wisconsin Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,786, issued on April 21, was assigned to Illinois Tool Works Inc. (Glenview, Ill.). "Systems and methods to configure a robotic welding sy... Read More


US Patent Issued to TOYOTA JIDOSHA on April 21 for "Resistance spot welding method and resistance spot welding apparatus" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,787, issued on April 21, was assigned to TOYOTA JIDOSHA K.K. (Toyota, Japan). "Resistance spot welding method and resistance spot welding ... Read More


US Patent Issued to TOKYO SEIMITSU on April 21 for "Laser machining device, wafer processing system, and method for controlling laser machining device" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,788, issued on April 21, was assigned to TOKYO SEIMITSU Co. LTD. (Tokyo). "Laser machining device, wafer processing system, and method for... Read More


US Patent Issued on April 21 for "Laser cutting method using spatial light modulator and laser cutting device" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,789, issued on April 21. "Laser cutting method using spatial light modulator and laser cutting device" was invented by Chun-Jung Chiu (New... Read More


US Patent Issued to Schaeffler Technologies, Continental Autonomous Mobility Germany on April 21 for "Welding methods for making die cast mould part and actuator housing" (German Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,790, issued on April 21, was assigned to Schaeffler Technologies AG & Co. KG (Herzogenaurach, Germany) and Continental Autonomous Mobility ... Read More


US Patent Issued to DIRECTEDMETAL 3D on April 21 for "Laser devices and methods for laser metal deposition" (Spanish Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,791, issued on April 21, was assigned to DIRECTEDMETAL 3D SL (Linares, Spain). "Laser devices and methods for laser metal deposition" was ... Read More


US Patent Issued to Allotex on April 21 for "Corneal treatment" (American, Swiss Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,792, issued on April 21, was assigned to Allotex Inc. (Boston). "Corneal treatment" was invented by David Muller (Boston) and Michael Mroc... Read More